Patent · US Active

Method for monitoring the total amount of sulphur containing compounds in a metal plating bath

US11761090B2 · kind B2 · utility

0Cited by

4References

18Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Andreas Kirbs · Berlin, DE
Christian Wendeln · Berlin, DE
Edith Steinhäuser · Berlin, DE
Sebastian ZARWELL · Berlin, DE
Kevin-Sigurt Gottschalk · Berlin, DE
Mayumi Nishikido · Berlin, DE

Key dates

Filing date	Dec 2, 2016
Grant date	Sep 19, 2023
Priority date	—
Expiry date	Feb 13, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01N27/49
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The present invention relates to a method for monitoring the total amount of sulphur containing compounds in a metal or metal alloy plating bath, wherein the sulphur containing compounds contain at least one sulphur atom having an oxidation state below +6, the method comprising the steps (a), (b), optionally (c), and (d). Said method is a means of providing control over a metal plating process. Thus, the present invention relates furthermore to a controlled process for plating a metal on a substrate utilizing the method of the present invention for monitoring the total amount of said sulphur containing compounds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.