Detaching a die from an adhesive tape by air ejection
US11764098B2 · kind B2 · utility
0Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2021 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Apr 16, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.