Electronic package and method for manufacturing the same
US11764162B2 · kind B2 · utility
0Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2020 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Aug 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.