RF devices including an RF chip having an electrical redistribution layer with RF antennas formed therein and methods of manufacture

US11764453B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Walter Hartner · Munich, DE
• Bernhard Rieder · Regensburg, DE

Key dates

• Filing date: May 4, 2021
• Grant date: Sep 19, 2023
• Expiry date: May 4, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10098
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.