Additive manufactured 3D electronic substrate
US11765839B2 · kind B2 · utility
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3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2018 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Oct 4, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49073
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.