Apparatus for plasma dicing
US11769675B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Jun 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further including a carrier sheet on a frame member, where the carrier sheet carries the semiconductor substrate. The apparatus includes a chamber, a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate, a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet, and a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.