David Tossell
7Patents
2h-index
9Co-inventors
44Inventor score
Filing activity: Sep 10, 1998 → Apr 30, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6876534B2 | Method of clamping a wafer during a process that creates asymmetric stress in the wafer | Electricity | 5 | Expired |
| US10283381B2 | Apparatus for plasma dicing | Electricity | 3 | Active |
| US6256186A | Electrostatic chucks | Emerging Cross-Sectional Technologies | 2 | Expired |
| US9159599B2 | Apparatus for chemically etching a workpiece | Electricity | 1 | Active |
| US10366899B2 | Method of detecting a condition | Electricity | 0 | Active |
| US11769675B2 | Apparatus for plasma dicing | Electricity | 0 | Active |
| US6649527B2 | Method of etching a substrate | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.