Manufacturing method of semiconductor package
US11769685B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2021 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Jan 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a semiconductor package is provided. The manufacturing method includes the following. A plurality of semiconductor components are provided. Each semiconductor component has at least one conductive bump. A substrate is provided. The substrate has a plurality of conductive pads. A transfer device is provided. The transfer device transfers the semiconductor components onto the substrate. A heating device is provided. The heating device heats or pressurizes at least two semiconductor components. During transferring of the semiconductor components to the substrate, the at least one conductive bump of each semiconductor component is docked to a corresponding one of the conductive pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.