Heterogeneous integration module comprising thermal management apparatus

US11769710B2 · kind B2 · utility

Assignee

• XILINX, INC. · US

Inventors

• Gamal Refai-Ahmed · Markham, CA
• Suresh Ramalingam · Fremont, US
• Ken Chang · Cerritos, US
• Mayank Raj · San Jose, US
• Chuan Xie · Fremont, US
• Yohan Frans · Palo Alto, US

Key dates

• Filing date: Mar 27, 2020
• Grant date: Sep 26, 2023
• Expiry date: Oct 21, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2023/4075
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.