Patent · US Active

Lead frames having rounded corners and related packages and methods

US11769713B2 · kind B2 · utility

0Cited by
3References
20Claims
0Family size

Assignee

Inventor

Key dates

Filing dateAug 12, 2022
Grant dateSep 26, 2023
Priority date—
Expiry dateAug 12, 2042

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/181
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Lead frames for semiconductor device packages may include lead fingers proximate to a die-attach pad. A convex corner of the lead frame proximate to a geometric center of the lead frame may be rounded to include a radius of curvature of at least two times a greatest thickness of the die-attach pad. The thickness of the die-attach pad may be measured in a direction perpendicular to a major surface of the die-attach pad. A shortest distance between the die-attach pad and each one of the lead fingers having a surface area larger than an average surface area of the lead fingers may be at least two times the greatest thickness of the die-attach pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.