Patent · US Active

Method of controlling the placement of micro-objects on a micro-assembler

US11772964B2 · kind B2 · utility

0Cited by

2References

9Claims

0Family size

Assignee

Xerox Corporation · US

Inventors

Anne Plochowietz · Mountain View, US
Bradley Rupp · San Francisco, US
JengPing Lu · San Jose, US
Julie A. Bert · East Palo Alto, US
Lara S. Crawford · Belmont, US
Sourobh Raychaudhuri · Mountain View, US
Eugene M. Chow · Fremont, US
Matthew Shreve · Mountain View, US
Sergey Butylkov · Oakland, US

Key dates

Filing date	Feb 4, 2022
Grant date	Oct 3, 2023
Priority date	—
Expiry date	Feb 4, 2042

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/5313
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.