Methods and apparatus for creating a large area imprint without a seam
US11774851B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Nov 27, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2995/0027
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present disclosure generally relate to imprint lithography, and more particularly to methods and apparatus for creating a large area imprint without a seam. Methods disclosed herein generally include separating the curing time of the features in a stamp or product from the curing time of the seam and the periphery. The seam and periphery can be cured first or the seam and periphery can be cured last. Additionally, the seam curing operations can be performed on the master, on the stamp, or on the final product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.