Substrate processing apparatus and substrate processing method
US11776791B2 · kind B2 · utility
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2References
3Claims
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Key dates
| Filing date | May 28, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Nov 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/46
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus are provided. The substrate processing apparatus allows a supply flow rate per unit time for process gas supplied to the central area of a substrate to be greater than a supply flow rate per unit time for process gas supplied to an edge area of the substrate, when processing the edge area of the substrate supported by the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.