Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

US11776821B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Ziyin Lin · Chandler, US
• Vipul V. Mehta · Chandler, US
• Edvin Cetegen · Chandler, US
• Yuying Wei · Chandler, US
• Sushrutha Gujjula · Chandler, US
• Nisha Ananthakrishnan · Chandler, US
• Shan Zhong · Clarksville, US

Key dates

• Filing date: Feb 10, 2022
• Grant date: Oct 3, 2023
• Expiry date: Feb 10, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/09045
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. An encapsulant is over the protrusion of the substrate, the encapsulant extending beneath the first die, and the encapsulant extending beneath the second die.