Apparatus and method for treating substrate
US11776826B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Aug 21, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jan 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/683
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for treating a substrate includes a process chamber having a process space therein, a support unit that supports the substrate in the process space, a heating member that heats the substrate supported on the support unit, and an exhaust unit that evacuates the process space. The exhaust unit includes an exhaust duct and a heat retention unit having a retention space that retains heat released from the process space. The retention space surrounds an adjacent area located adjacent to the process chamber in the exhaust duct.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.