Patent · US Active

Lid structure and semiconductor device package including the same

US11776862B2 · kind B2 · utility

0Cited by

6References

7Claims

0Family size

Assignee

ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventors

Chun-Han Chen · Taichung, TW
Hsun-Wei Chan
Mei-Yi Wu · Kaohsiung, TW

Key dates

Filing date	Sep 21, 2020
Grant date	Oct 3, 2023
Priority date	—
Expiry date	Oct 11, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/164
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.