Package device
US11776914B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2022 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jun 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49822
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a second dielectric layer, and a conductive layer. The second dielectric layer is disposed on the first dielectric layer, and the second dielectric layer includes a dielectric pattern. The conductive layer is disposed between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive pattern. The dielectric pattern has a through hole, and in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.