Die bond head apparatus with die holder motion table
US11776930B2 · kind B2 · utility
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1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2019 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Mar 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83132
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die bond head apparatus has a die bond head body coupled to a die bond head motion table, a die holder motion table mounted on the die bond head body and a die holder which is operative in use to secure a semiconductor die to a substrate. The die holder is positionable by the die holder motion table independently of the die bond head motion table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.