Multi-layer film device and method
US11777035B2 · kind B2 · utility
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43References
20Claims
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Key dates
| Filing date | Jun 27, 2022 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jun 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.