Semiconductor device package and method of manufacturing the same
US11777191B2 · kind B2 · utility
0Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jan 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a wireless communication module. The wireless communication module includes a first antenna layer and a second antenna layer non-coplanar with the second antenna layer. An electromagnetic wave of the first antenna and the second antenna are configured to have far-field interference to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.