In-packaged multi-channel light engine on single substrate
US11777631B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Dec 28, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4243
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.