Exhaust module for wafer baking apparatus and wafer processing system having the same
US11779871B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2019 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Mar 5, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70916
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present disclosure provides an exhaust module for exhausting an exhaust from at least one wafer baking apparatus having an exhaust port. The exhaust module includes at least one pipeline, a heating unit, a solvent dispensing unit, and a filtering unit. The at least one pipeline is connected to the exhaust port of the wafer baking apparatus and configured to exhaust the exhaust gas from the wafer baking apparatus. The heating unit is connected to the pipeline and configured to heat the exhaust gas. The solvent dispensing unit is connected to the heating unit and configured to dispense a solvent to cool and dissolve the exhaust gas. The filtering unit is connected to the solvent dispensing unit and configured to filter the solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.