Patent · US Active

Plating apparatus and plating method

US11781235B2 · kind B2 · utility

0Cited by

2References

10Claims

0Family size

Assignee

ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

Yinuo Jin · Shanghai, CN
Hongchao Yang · Shanghai, CN
Jian Wang · Rosharon, US
Hui Wang · Shanghai, CN

Key dates

Filing date	Dec 28, 2018
Grant date	Oct 10, 2023
Priority date	—
Expiry date	Dec 28, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P10/20
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode (3001); step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value P11 and continue with a period T11 (3002); step 3: when the period T11 ends, adjusting the first plating power supply applied on the first anode to output a power value P12 and continue with a period T12, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value P21 and continue with a period T21 (3003); and step 4: when the period T21 ends, adjusting the second plating power supply applied on the second anode to output a power value P22 and continue with a period T22; wherein step 2 to step 4 are performed periodically.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.