Patent · US Active

Tilted magnetron in a PVD sputtering deposition chamber

US11784032B2 · kind B2 · utility

0Cited by

0References

16Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Lizhong Sun · San Jose, US
Xiaodong Yang · New York, US
Yufei Zhou · Shanghai, CN
Yi Yang · New Taipei, TW

Key dates

Filing date	Nov 14, 2018
Grant date	Oct 10, 2023
Priority date	—
Expiry date	Nov 14, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/332
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A chamber includes a target (16) and a magnetron (50) disposed over the target (16). The magnetron (50) includes a plurality of magnets (52, 54). The magnetron (50) has a longitudinal dimension and a lateral dimension. The longitudinal dimension of the magnetron (50) is tilted with respect to the target (16) so the distances between magnets (52, 54) and the target (16) vary. As the magnetron (50) rotates during operation, the strength of the magnetic field produced by the magnetron (50) is an average of the various strengths of magnetic fields produced by the magnets (52, 54). The averaging of the strengths of the magnetic fields leads to uniform film properties and uniform target erosion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.