Patent · US Active

Semiconductor devices comprising a lid structure and methods of manufacturing semiconductor devices comprising a lid structure

US11784101B2 · kind B2 · utility

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20Claims
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Assignee

Inventors

Key dates

Filing dateMar 2, 2020
Grant dateOct 10, 2023
Priority date—
Expiry dateApr 1, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2224/16225
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In one example, a semiconductor device comprises a substrate comprising a conductive structure, an electronic component over a top side of the substrate and electrically coupled with the conductive structure, a lid structure over the substrate and over the electronic component, and a vertical interconnect in the lid structure extending to a top surface of the lid structure and electrically coupled with the conductive structure. Other examples and related methods are also disclosed herein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.