Single metal cavity antenna in package connected to an integrated transceiver front-end

US11784143B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Sonja Koller · Regensburg, DE
• Kilian Roth · Munich, DE
• Josef Hagn · Neubiberg, DE
• Andreas Wolter · Regensburg, DE
• Andreas Augustin · Munich, DE

Key dates

• Filing date: May 23, 2019
• Grant date: Oct 10, 2023
• Expiry date: Jan 7, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01P5/107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments include semiconductor packages and methods of forming the semiconductor packages. A semiconductor package includes a die over a substrate, a first conductive layer over the die, and a conductive cavity antenna over the first conductive layer and substrate. The conductive cavity antenna includes a conductive cavity, a cavity region, and a plurality of interconnects. The conductive cavity is over the first conductive layer and surrounds the cavity region. The semiconductor package also includes a second conductive layer over the conductive cavity antenna, first conductive layer, and substrate. The conductive cavity extends vertically from the first conductive layer to the second conductive layer. The cavity region may be embedded with the conductive cavity, the first conductive layer, and the second conductive layer. The plurality of interconnects may include first, second, and third interconnects. The first interconnects may include through-mold vias (TMVs), through-silicon vias (TSVs), conductive sidewalls, or conductive trenches.