Redistribution layer connection
US11784151B2 · kind B2 · utility
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30Claims
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Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Jul 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Examples herein include die to metallization structure connections that eliminate the solder joint to reduce the resistance and noise on the connection. In one example, a first die is attached to a metallization layer by a plurality of copper interconnections and a second is attached to the metallization layer opposite the first die through another plurality of copper interconnections. In this example, the copper interconnects may connect the respective die to a metallization structure in the metallization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.