Marcus HSU
8Patents
2h-index
13Co-inventors
40Inventor score
Filing activity: Mar 15, 2013 → Feb 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11682607B2 | Package having a substrate comprising surface interconnects aligned with a surface of the substrate | Electricity | 7 | Active |
| US9484327B2 | Package-on-package structure with reduced height | Electricity | 4 | Active |
| US10804195B2 | High density embedded interconnects in substrate | Electricity | 0 | Active |
| US11404343B2 | Package comprising a substrate configured as a heat spreader | Electricity | 0 | Active |
| US11456291B2 | Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods | Electricity | 0 | Active |
| US11527498B2 | Bump pad structure | Electricity | 0 | Active |
| US11552023B2 | Passive component embedded in an embedded trace substrate (ETS) | Electricity | 0 | Active |
| US11784151B2 | Redistribution layer connection | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.