Techniques for wafer level die testing using sacrificial structures
US11788929B1 · kind B1 · utility
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15Claims
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Key dates
| Filing date | Sep 29, 2022 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Sep 29, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/30
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of testing a photonics die at the wafer level includes providing a sacrificial waveguide and a grating coupler at least partially in a scribe line between dies of a wafer, performing one or more tests on the dies of the wafer via the sacrificial waveguide and grating coupler in the scribe line, and removing the sacrificial waveguide during separation of the dies of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.