Brett E. Huff
14Patents
7h-index
16Co-inventors
63Inventor score
Filing activity: Nov 14, 1988 → Jan 26, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5028490A | Metal/polymer composites | Emerging Cross-Sectional Technologies | 49 | Expired |
| US5872401A | Deposition of an inter layer dielectric formed on semiconductor wafer by sub atmospheric CVD | Electricity | 25 | Expired |
| US5950107A | In-situ pre-ILD deposition treatment to improve ILD to metal adhesion | Electricity | 23 | Expired |
| US5872064A | DSAD process for deposition of inter layer dielectric | Electricity | 14 | Expired |
| US5389581A | High density TEOS-based film for intermetal dielectrics | Electricity | 12 | Expired |
| US6096230A | Method of planarizing by polishing a structure which is formed to promote planarization | Electricity | 9 | Expired |
| US10983200B1 | Techniques for on-chip polarization management | Physics | 8 | Active |
| US6645353B2 | Approach to optimizing an ILD argon sputter process | Electricity | 4 | Expired |
| US11061123B1 | Techniques for on-chip polarization management using polarizing waveguides | Physics | 3 | Active |
| US6572425B2 | Methods for forming microtips in a field emission device | Electricity | 1 | Expired |
| US12326593B1 | Techniques for singulating photonics die with optical quality edge | Physics | 0 | Active |
| US6771011B2 | Design structures of and simplified methods for forming field emission microtip electron emitters | Electricity | 0 | Expired |
| US11788929B1 | Techniques for wafer level die testing using sacrificial structures | Physics | 0 | Active |
| US11940572B2 | Polarization splitter-rotator having silicon based waveguide with silicon nitride segment | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.