Co-axial via structure
US11792918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Nov 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0959
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.