Method for fabricating carrier structure
US11792938B2 · kind B2 · utility
0Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2020 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Jan 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10568
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.