Inventor · Bukit Mertajam, MY

Chee-Key Chung

26Patents
3h-index
35Co-inventors
63Inventor score

Filing activity: Jun 30, 2003 → Dec 12, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9754849B2 Organic-inorganic hybrid structure for integrated circuit packages Electricity 34 Active
US10361150B2 Substrate construction and electronic package including the same Electricity 4 Active
US7701069B2 Solder interface locking using unidirectional growth of an intermetallic compound Emerging Cross-Sectional Technologies 3 Expired
US11676948B2 Method for fabricating electronic package Electricity 3 Active
US11315881B1 Electronic package and manufacturing method thereof Electricity 3 Active
US10600708B2 Electronic package and method for fabricating the same Electricity 2 Active
US11056470B2 Electronic package and method for fabricating the same Electricity 2 Active
US10741500B2 Electronic package Electricity 1 Active
US11482470B2 Electronic package and fabrication method thereof Electricity 1 Active
US10863626B1 Electronic package carrier structure thereof, and method for fabricating the carrier structure Electricity 1 Active
US11410954B2 Electronic package, manufacturing method thereof and conductive structure Electricity 0 Active
US9887110B2 Substrate warpage control using temper glass with uni-directional heating Electricity 0 Active
US7229913B2 Stitched micro-via to enhance adhesion and mechanical strength Electricity 0 Expired
US10950520B2 Electronic package, method for fabricating the same, and heat dissipator Electricity 0 Active
US10763237B2 Method for manufacturing electronic package Electricity 0 Active
US11289346B2 Method for fabricating electronic package Electricity 0 Active
US11881459B2 Electronic package and fabrication method thereof Electricity 0 Active
US7692301B2 Stitched micro-via to enhance adhesion and mechanical strength Electricity 0 Active
US10354891B2 Electronic package and method for fabricating the same Electricity 0 Active
US12100642B2 Electronic package and fabrication method thereof Electricity 0 Active
US11792938B2 Method for fabricating carrier structure Electricity 0 Active
US12205906B2 Electronic package and fabrication method thereof Electricity 0 Active
US12176327B2 Method for fabricating electronic package Electricity 0 Active
US10522500B2 Method for manufacturing electronic package Electricity 0 Active
US11069661B1 Electronic package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.