Patent · US Active

Method of cooling a deposition source, chamber for cooling a deposition source and deposition system

US11795541B2 · kind B2 · utility

0Cited by

2References

9Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Claire ARMSTRONG · Gummersbach, DE
Frank SCHNAPPENBERGER · Johannesberg, DE
Thomas DEPPISCH · Aschaffenburg, DE

Key dates

Filing date	Nov 16, 2017
Grant date	Oct 24, 2023
Priority date	—
Expiry date	Jan 2, 2038

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C14/243
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method (100) of cooling a deposition source (200) is described. The method includes stopping (110) depositing material from the deposition source, the deposition source being arranged in a deposition chamber (250), and introducing (120) a cooling gas into the deposition chamber (250), the cooling gas comprising a thermal conductivity λ of λ≥0.05 [W/(m*K)]. Further, a chamber for cooling a deposition source is described. The chamber includes a deposition source being arranged in the chamber. Further, the chamber includes a cooling gas supply system configured for providing a cooling gas into the chamber, the cooling gas comprising a thermal conductivity λ of λ≥0.05 [W/(m*K)].

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.