Method and device for electrically contacting components in a semiconductor wafer

US11796567B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Michael Bergler · Etzenricht, DE
• Roland Zeisel · Tegernheim, DE

Key dates

• Filing date: Mar 9, 2020
• Grant date: Oct 24, 2023
• Expiry date: Aug 13, 2040

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/0491
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for electrically contacting components in a semiconductor wafer includes providing a flexible board comprising a first main surface on which a plurality of conductor tracks are arranged, positioning the board with respect to a semiconductor wafer such that the first main surface of the board faces the semiconductor wafer, the board is bent and pressed onto the semiconductor wafer in such a way that contact elements of a plurality of components arranged in a row in the semiconductor wafer come into contact with the conductor tracks, and electrical signals are applied to the components through the conductor tracks.