Force sensor in an ultrasonic wire bonding device
US11798911B1 · kind B1 · utility
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18References
12Claims
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Assignee
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Key dates
| Filing date | Apr 25, 2022 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Apr 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/7892
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.