Integrated circuit with inductive pickup loop
US11799438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2021 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Dec 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K39/00
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An integrated circuit including a first circuit module and a second circuit module is provided. A layer stack may include one or multiple metal layers with a power segment and a ground segment connected to the first circuit module and the second circuit module, which form a resonant current loop. A pickup loop may be inductively coupled to the resonant current loop to dampen its resonance, thereby making the IC compliant with its EMC requirements or removing functional errors such as problems in the signal or power integrity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.