Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent
US11802177B2 · kind B2 · utility
0Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2018 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Jul 16, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.