Opto-electronic package and a method for making an opto-electronic package
US11803021B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2021 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Mar 29, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4267
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.