Substrate treatment apparatus and method of performing treatment process on substrate
US11804371B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2020 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Oct 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate treatment apparatus including a treatment container equipped with a conductive member. The conductive member is made of a material having a lower resistivity than that of the treatment container. The conductive member prevents a rise of an electric potential of the treatment container, which is caused by charging during treatment of a substrate, thereby preventing the substrate from being contaminated and damaged by particles and electrostatic arcing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.