Thin-film non-uniform stress evaluation
US11804410B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 5, 2020 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Apr 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67288
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for evaluation of thin film non-uniform stress using high order wafer warpage, the steps including measuring a net wafer warpage across a wafer area due to thin film deposition, fitting a two dimensional low-order polynomial to the wafer warpage measurements and subtracting the low-order polynomial from the net wafer warpage across the wafer area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.