Radiative heat collective bonder and gangbonder
US11804467B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2020 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Dec 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06565
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A radiative heat collective bonder or gangbonder for packaging a semiconductor die stack is provided. The bonder generally includes a shroud positioned at least partially around the die stack and a radiative heat source positioned inward of the shroud and configured to emit a radiative heat flux in a direction away from the shroud. The bonder may further include a bondhead configured to contact the backside of the topmost die in the die stack and optionally include another bondhead configured to contact a substrate beneath the die stack. The radiative heat source may be configured to direct the radiative heat flux to at least a portion of the die stack to reduce a vertical temperature gradient in the die stack. One or both of the bondheads may be configured to concurrently direct a conductive heat flux into the die stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.