Semiconductor laser and manufacturing method for a semiconductor laser
US11804696B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2019 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Dec 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0424
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser (1) is provided that includes a semiconductor layer sequence in which an active zone for generating laser radiation is located. A ridge waveguide is formed as an elevation from the semiconductor layer sequence. An electrical contact layer is located directly on the ridge waveguide. A metallic electrical connection region is located directly on the contact layer and is configured for external electrical connection of the semiconductor laser. A metallic breakage coating extends directly to facets of the semiconductor layer sequence and is arranged on the ridge waveguide. The breakage coating is electrically functionless and includes comprises a lower speed of sound for a breaking wave than the semiconductor layer sequence in the region of the ridge waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.