UV-curable resins used for chemical mechanical polishing pads
US11807710B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2021 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Oct 18, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator. The invention also provides a method of forming a chemical-mechanical polishing pad using the UV-curable resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.