Patent · US Active

Composition, method for cleaning adhesive polymer, method for producing device wafer, and method for regenerating support wafer

US11807837B2 · kind B2 · utility

1Cited by
2References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 26, 2019
Grant dateNov 7, 2023
Priority date
Expiry dateAug 16, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/02057
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Provided is a composition having high affinity for the surface of an adhesive, and excellent long-term storage stability. This composition comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and an aprotic solvent, wherein the aprotic solvent includes (A) an N-substituted amide compound having 4 or more carbon atoms and not containing active hydrogen on a nitrogen atom, and (B) an ether compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.