Patent assignee · JP · COMPANY

Resonac Corporation

271Patents
270Active
271Granted
60Portfolio score

Filing activity: May 11, 2016 → Apr 30, 2024

Most-cited patents

PatentTitleAreaCited byStatus
US11705157B2 Ferroelectric recording medium and ferroelectric storage apparatus Physics 2 Active
US11820742B2 Fluorine-containing ether compound, lubricant for magnetic recording medium, and magnetic recording medium Chemistry; Metallurgy 2 Active
US11814568B2 Anisotropic thermal conductive resin member and manufacturing method thereof Electricity 2 Active
US11915799B2 Polymer physical property prediction device, recording medium, and polymer physical property prediction method Physics 1 Active
US11795577B2 SiC epitaxial wafer and method of manufacturing SiC epitaxial wafer Electricity 1 Active
US11787882B2 Ultrahigh molecular weight propylene (co)polymer Chemistry; Metallurgy 1 Active
US11979990B2 Wiring board and method for manufacturing the same Electricity 1 Active
US11807837B2 Composition, method for cleaning adhesive polymer, method for producing device wafer, and method for regenerating support wafer Electricity 1 Active
USD999690S1 Bumper reinforcement for automobile General 1 Active
US11939699B2 SiC substrate and SiC ingot Chemistry; Metallurgy 1 Active
US11879109B2 Fluorine-containing ether compound, lubricant for magnetic recording medium, and magnetic recording medium Chemistry; Metallurgy 1 Active
US12004305B2 Wiring board and production method for same Electricity 1 Active
US12166087B2 SiC epitaxial wafer and method for manufacturing SIC epitaxial wafer Electricity 1 Active
US12099935B2 Technical knowledge prediction apparatus, method, and program Emerging Cross-Sectional Technologies 1 Active
US11866846B2 SiC substrate and SiC epitaxial wafer Chemistry; Metallurgy 1 Active
US12122944B2 Hot melt adhesive composition Chemistry; Metallurgy 0 Active
US11890592B2 Method for producing silica carrier, and silica carrier Performing Operations; Transporting 0 Active
US12356687B2 SiC epitaxial wafer and method for manufacturing SiC epitaxial wafer Electricity 0 Active
US11840648B2 Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material Electricity 0 Active
US12285767B2 Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive film Performing Operations; Transporting 0 Active
US11674039B2 Polyamideimide resin composition and flourine-based coating material Chemistry; Metallurgy 0 Active
US12142764B2 Positive electrode mixture layer, conductive additive, positive electrode mixture, and lithium-ion secondary battery Emerging Cross-Sectional Technologies 0 Active
US12362363B2 Electrode binder for a nonaqueous secondary battery and nonaqueous secondary battery electrode Emerging Cross-Sectional Technologies 0 Active
US12116675B2 Adhesion removal method and film-forming method Electricity 0 Active
US12032043B2 Magnetic sensor Electricity 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.