Structures and methods for high speed interconnection in photonic systems
US11808977B2 · kind B2 · utility
1Cited by
3References
20Claims
0Family size
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Key dates
| Filing date | Dec 13, 2022 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Dec 13, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12164
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Structures and methods for high speed interconnection in photonic systems are described herein. In one embodiment, a photonic device is disclosed. The photonic device includes: a substrate; a plurality of metal layers on the substrate; a photonic material layer comprising graphene over the plurality of metal layers; and an optical routing layer comprising a waveguide on the photonic material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.