Method for controlling a lithographic apparatus
US11809088B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Jul 22, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70525
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of determining a control setting for a lithographic apparatus. The method includes obtaining a first correction for a current layer on a current substrate based on first metrology data associated with one or more previous substrates, and obtaining a second correction for the current layer on the current substrate. The second correction is based on a residual determined based on second metrology data associated with a previous layer on the current substrate. The method further includes determining the control setting for the lithographic apparatus for patterning the current layer on the current substrate by combining the first correction and the second correction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.