Plasma processing apparatus
US11810758B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 2018 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Oct 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus includes a chamber having a space therein and configured to process a target object loaded into the space by plasma generated in the space; a gas supply unit configured to supply a processing gas into the space of the chamber; a high frequency antenna having a plurality of lines adjacent to each other and configured to generate the plasma in the space by an induced electric field generated in the space by a current flowing in the lines; and a plurality of holders configured to hold the lines of the high frequency antenna. The holders are arranged on the respective lines of the high frequency antenna such that the adjacent holders are spaced from each other by a gap of a predetermined distance or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.