Patent · US Active

Electrical contact for semiconductor package

US11811180B2 · kind B2 · utility

0Cited by

21References

18Claims

0Family size

Assignee

IXYS Semiconductor GmbH · DE

Inventors

Yong Ai-Ong · Singapore, SG
Thomas Spann · Ergolding, DE

Key dates

Filing date	Aug 31, 2021
Grant date	Nov 7, 2023
Priority date	—
Expiry date	Oct 22, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01R13/04
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Provided herein are semiconductor packages with improved electrical contacts (e.g. pins). In some embodiments, an assembly may include a substrate and an electrical contact coupled to the substrate, the electrical contact consisting of a first component defined by a complex 3D designed receiving pin. The electrical contact may further include a second component defined by another complex 3D designed penetrating pin, wherein the first component engages the second component to deform mechanically and to weld when the first component and the second component are coupled together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.